Specification
- Package: BGA
- Features: Enable (EN), FCCM, OTP, Over-Current Protection (OCP), Over-Voltage Protection (OVP), Power Good, Short-Circuit Protection, Soft Start, Under-Voltage Protection (UVP)
- Module Assembly: Encapsulated
- Vin [V]: 3 V ... 16 V
- Vout [V]: 0.6 V ... 5.5 V
- Iout max. [A]: 5 A
- fsw [kHz]: 1,000 kHz ... 1,000 kHz
- I2C Interface: no
- PG: no
- SS [Internal / External]: External
- Operating Junction Temperature Range [°C]: -40 °C ... 125 °C
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