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Thermal Interfaces
COOLPad® Silicon Thermal PADs
COOLPad® is a line of high performance thermal interface pads, developed to address the industry’s growing requirements for easy application, low levels of thermal resistance and high conformability, even at the most challeging and uneven surfaces.
- high compressibility
- low thermal resistance
- flexible delivery format
FlexGRAF® Thermally Conductive Graphite
FlexGRAF® redefines thermal interface materials with its exceptional thermal conductivity, delivering uniform heat distribution both in and through the plane. This property effectively prevents hotspot formation, ensuring reliable and efficient thermal management.
- very high thermal conductivity
- easy handling & installation
- flexible delivery format
THERMALTape® Thermally Conductive Tapes
THERMALTape® is a double-sided adhesive tape with ultra-high adhesion strength which can be used to attach componentes and PCI (Circuit Boards) to heatsinks, eliminating the use of mechanical fixing elements ensuring low thermal resistance interface and thus optimizing the heat flow to the environment.
- high adhesion strenght
- electrically insulating
- good thermal conductivity
- flexible delivery format
FORMAPad® Dispensable Gap Pads
FORMAPad® combines the best features of a high-performance Thermal Grease and those of Silicone Thermal Pads. It is available as mono and bi-component products, which are applied in the same way that a liquid adhesive or a thermal grease, filling perfectly even the most uneven surfaces.
- high thermal conductivity
- easy to apply
- long service life
LEDGlue® Silicon Adhesives
LEDGlue® is a fluid silicone adhesive, which has been developed to provide excellent thermal conductivity, besides the mechanical attachment of the eletronic components. It adhesives are ideal elastomeric solution for intense heat generating components.
- optimal adhesion strenght
- mono component
- reduced curing time
- easy to apply
COOLPhase® PHASE CHANGE THERMAL PADS
COOLPhase® sets a new standard in thermal management solutions, providing.durability and effective heat transfer for a wide range of applications.
- high thermal conductivity
- low contact resistance
- easy assembly & flexible delivery format