GD25LX256E

Specification

Package: 25 TFBGA, 16 SOP, WLCSP
Memory Size [Mb]: 512
Type: SPI NOR Flash
Vcc [V]: 1.8 V
Temperature Range [°C]: -40 °C ... 125 °C

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Produktdaten

Amount (required input)

Jahresmenge (muss ausgefüllt werden)

Projekt / Applikation (muss ausgefüllt werden)

SOP (Projektlaufzeit)

Company data

Company (required input)

Department

Personal data

Salutation

Full name (required input)

Address data

Street Address (required input)

Zip-Code (required input)

City (required input)

Country (required input)

Contact data

Phone (required input)

E-Mail (required input)

Message

Legal information

I have read and accepted the legal disclosures.

I have read and accepted the data protection declaration.

I agree with the processing of my personal data

GD25LX256E

Specification

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Manufacturer

GigaDevice

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